| PastePuck
is an economical, low profile, captive media printing system
that sets new standards for efficiency and simplicity. PastePuck
is ideal for those who require the print quality benefits
that only pressurised printing can bring. It can be retrofitted
to almost any machine providing a low cost enclosed print
head solution.
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| PastePuck
Takes a Bow |
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Surface Mount Technology is the current vogue
in electronics assembly. The printed circuit
boards in your mobile phone and computer are
likely to have been assembled using solder
paste. The paste is stencil printed onto the
bare board, components are carefully placed
on the solder paste pads and the whole board
is sent through a oven where the solder paste
is reflowed to make lasting joints.
Printing solder paste has traditionally been
a very wasteful process with some operations
having to throw away up to 70% of the solder
paste in order to maintain print quality.
The paste has a tendency to "dry out" and
even "crust" while on the stencil which has
severe detrimental effects on the repeatability
of the printing process.
Now Pastepuck Ltd has introduced a new, low
cost pressurised printing system that reduces
paste waste to virtually nil. It also improves
the shape and definition of print deposits,
cleans up the whole process and isolates operators
from the potentially harmful, lead bearing,
solder paste.
A further major benefit of the paste puck
lies in its retrofitability. It can be fitted
to virtually any make and model of stencil
printer, enabling assemblers with a variety
of printing machines to standardise on one
print technology. It requires no auxiliary
power and is not dependent on the printer's
software in order to work.
With the new PastePuck costing in the region
of £5000, the initial outlay in many instances
can be recouped in a matter of months and
thereafter, considerable material savings
accrue.
The PastePuck is available in two print window
sizes, 300mm and 380mm but each can be tailored
to meet specific print pattern sizes with
the use of Trim Tab Reducers that ensure optimum
utilisation of the print medium.
Most solder pastes can be left in the PastePuck
overnight with the Puck resting on the stencil,
and will print easily the following morning,
reducing the need for clean down and again
reducing paste waste.
If required, the solder paste can be sealed
within the Puck and the Puck removed from
the machine for long-term storage under refrigeration
if necessary.
The Pastepuck utilises the paste cassettes
developed by Semco under license from DEK.
Most pastes are available in this form of
but cassettes can also be filled from conventional
cartridges.
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